We specialize in the manufacturing of small-format DPC (Direct Plated Copper) ceramic substrates, with dimensions up to 10x10mm and a thickness of under 0.6mm. Utilizing materials such as aluminum nitride (AlN) and alumina (Al2O3),
TEC AlN / Al₂O₃
TEC modules offer significant advantages including compact size, vibration-free operation, zero mechanical wear, silent performance, user-friendly control, and high reliability.
These benefits enable widespread applications across Electronics & Electrical Appliances，Automotive Systems，Medical Equipment，Optical Communications，Military Communications，Laboratory Instruments
Product Information Specification
Substrate Material: Aluminum Nitride (AlN) / Alumina (Al₂O₃)
Substrate Thickness: 0.15mm, 0.2mm, 0.25mm, 0.3mm, 0.5mm, 0.635mm, etc.
Metal Layer Thickness:
Cu: 25μm ±5
Ni/Pd/Au or Ni/Au (customizable per customer requirements)
Optional Processes:
Laser Pre-cutting / Dicing / Laser Solder Mask (customizable per customer requirements)
