CERAMIC METALLIZATION: DPC Process (DIRECT PLATING COPPER)
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The DPC process begins by depositing a composite copper metal layer onto a ceramic substrate via vacuum sputtering. Subsequently, a photolithography process is applied, involving photoresist coating, exposure.development, etching, and resist stripping to form the circuit patiern. Finally, the circuit thickness is increased through electro plating / electroless plating. After removing the residual photoresist, the metalized circuit fabrication is completed.
