An Encapsulation Dam is a critical structural component used in ceramic circuit boards to precisely control the flow and containment of liquid encapsulants (such as epoxy resins or silicones) during the packaging process.
An Encapsulation Dam is a critical structural component used in ceramic circuit boards to precisely control the flow and containment of liquid encapsulants (such as epoxy resins or silicones) during the packaging process.
✔ Enhanced Reliability – Protects wire bonds/chips from moisture, dust, and mechanical stress.
✔ Miniaturization – Enables precise encapsulation in compact designs.
✔ Thermal/Electrical Stability – Maintains performance in extreme environments.
